IG-200 Advanced Grounding and Bonding Applications
SKU:
$1,095.00
$1,095.00
per item
3 Day Course
The IG-200 is an advanced applications course as it explores the different layers of grounding and bonding in great detail. All students get the opportunity to work in 3 separate hands-on labs that showcase the instruments, methods, and data collection necessary to performing a successful investigation into the grounding, bonding, and electrical wiring for all types of environments, including data centers, telecommunication entrance facilities, telecommunication rooms, workstation locations, and many more. All of this can be accomplished within a classroom environment.
BICSI CECs: 21
Not available? Request a course.
The IG-200 is an advanced applications course as it explores the different layers of grounding and bonding in great detail. All students get the opportunity to work in 3 separate hands-on labs that showcase the instruments, methods, and data collection necessary to performing a successful investigation into the grounding, bonding, and electrical wiring for all types of environments, including data centers, telecommunication entrance facilities, telecommunication rooms, workstation locations, and many more. All of this can be accomplished within a classroom environment.
BICSI CECs: 21
Not available? Request a course.
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Course Details
Chapter 1 – Electrical Properties
AC and DC Voltage Characteristics
Amperage and Electromagnetic Fields
Series/Parallel Circuit Importance
Electric Utility Distribution
Premises Wiring Distribution
Copper and Copper Conductors
Conductor Insulation Properties
Impedance Characteristics
Impedance Calculations
Chapter Two – Grounding Electrode (Earthing) System
Purposes of the Grounding Electrode System (GES)
GES Components
Soil Characteristics
GES Characteristics
GES Testing GES HANDS-ON LAB***
Earth Ground Resistance
Resistance Improvement Methods
Other Considerations
Chapter Three – Equipment Grounding System (EGS)
EGS Purposes
EGS Components
EGS Characteristics and Installation Considerations
Troubleshooting Wiring and Grounding Problems
Metering Methods
Voltage Quality Issues
EGS HANDS-ON LAB***
Chapter Four – Telecommunication and Data Center Bonding Systems
Telecommunication Bonding Purposes
Telecommunication Bonding Components
ANSI/EIA/TIA-607B Bonding Methods
BICSI Bonding Methods
Bonding of High-Rise Buildings
Bonding of Multiple Buildings
Outside Plant Grounding and Bonding
Radio Tower Grounding
Telecommunication Bonding LAB***
Chapter Five – Site Survey and Grounding Inspections
Types of Checklist to Use
Sample Reports
Troubleshooting Methodologies
Importance of Quality Assurance
Chapter Six – Glossary of Terms
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Customization
This course can be customized by for the Canadian Electrical Code and applicable standards. Course Materials Comprehensive manual and course certificate will be provided to students. |
If you'd like additional information about this course or to schedule this as a suitcase course, call our consultants at (813) 252-1032, or contact us here.
